A family of hydrogenated styrene farnesene block copolymers for applications such as adhesives & sealants, gels, soft compounds, modifiers, nonwovens, various grips, films, and foams.
SEPTON Bio-Series
$0.00
Market: Adhesives, Composites, Construction Adhesive, Construction Sealant, Film & Flexible Packaging, General Industrial Adhesive, Industrial Sealant, Non-woven, Plastics, Sealants, TextilesProduct Type: Prepolymers & Polyols
Product Category: Monomer
Supplier: Kuraray
SEPTON™ BIO-series is synthesized from B-farnesene, a renewable monomer derived from sugarcane. Through established fermentation processes, proprietary yeast strains convert sugar sources such as sugarcane, into B-farnesene. When B-farnesene is polymerized, its unique chemical structure provides differentiated features from conventional hydrogenated styrenic block copolymers (HSBC). When compared with HSBC’s, SEPTON™ BIO-series exhibits higher flow-ability, good adhesion, lower hardness without plasticizer, good permanent and compression set, high grip performance, and improved damping properties over a wide temperature range.
SEPTON BIO-series lends itself to a broad range of applications including adhesives & sealants, gels, soft compounds, modifiers, nonwovens, various grips, films, and foams.
Available SEPTONâ„¢ Bio-Series Grades
| SF902 |
| SF903 |
| SF904 |
Features and Benefits:
- Strong and stable adhesion force across a wide temperature range
- High flow-ability
- Good process-ability
- High damping properties
- Bio-based Polymer
- High tan δ across a wide temperature range
- Low compression-set, low permanent set
- Lower hardness without plasticizer
- low oil bleed
- Excellent removability with no residue
Properties:
Typical Properties SF902 SF903 SF904
MW Middle High Low
Styrene Cont. 18 30 21
Hardness, Type A 8 21 25
MFR [200deg.C 21N], g/10 min No flow No flow 12
MFR [230deg.C 21N], g/10 min No flow No flow 48
100% Modulus*, MPa 0.2 0.2 0.3
Tensile Strength*, MPa 4.8 4.6 5.8
Elongation*, % 820 550 900
C.S [25deg.C], % 6 Broken 28
C.S [70deg.C], % 35 21 100
ODT**, deg.C 330 >350 210
* Compression molded sheet of 1mm thickness
** Order-Disorder transition Temperature
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 SF902 | SF903 | SF904
